{"id":28828,"date":"2026-06-16T08:44:13","date_gmt":"2026-06-16T00:44:13","guid":{"rendered":"https:\/\/nswautomation.com\/NSW\/?p=28828"},"modified":"2026-06-16T08:56:16","modified_gmt":"2026-06-16T00:56:16","slug":"nsw-automation-mapc","status":"publish","type":"post","link":"https:\/\/nswautomation.com\/NSW\/nsw-automation-mapc\/","title":{"rendered":"NSW Automation Becomes a Founding Member of Malaysia Advanced Packaging Consortium (MAPC) to Advance Semiconductor Innovation"},"content":{"rendered":"
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[vc_row css=”.vc_custom_1581061685693{margin-top: -70px !important;}”][vc_column width=”3\/4″ offset=”vc_col-lg-9 vc_col-md-9″ css=”.vc_custom_1556187883093{border-right-width: 1px !important;border-right-color: #e5e5e5 !important;border-right-style: solid !important;}”][vc_custom_heading source=”post_title” font_container=”tag:h1|font_size:28|text_align:left” use_theme_fonts=”yes”][vc_column_text css=”.vc_custom_1758763836270{padding-top: 10px !important;}” el_class=”text-events”]Author:<\/strong> Jason Koay,\u00a0 Last update on June 16, 2026, Prepared by the NSW Automation Marketing Team <\/em><\/span>[\/vc_column_text][vc_column_text css=”.vc_custom_1652344890504{margin-right: -15px !important;margin-left: -15px !important;}” el_class=”text-events”]

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NSW Automation is proud to be a founding member of the Malaysia Advanced Packaging Consortium (MAPC), a national initiative established to accelerate advanced semiconductor packaging capabilities and strengthen Malaysia\u2019s position within the global semiconductor value chain.<\/p>\n

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Representatives from the MAPC founding members during the Memorandum of Understanding (MOU) signing ceremony at SEMICON Southeast Asia 2026<\/p>\n

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Officially launched through a Memorandum of Understanding (MOU) signing during SEMICON Southeast Asia 2026, MAPC represents a strategic collaboration between industry leaders and the government aimed at strengthening local innovation, developing engineering talent, and advancing Malaysia\u2019s next-generation semiconductor manufacturing capabilities.<\/p>\n

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Backed by RM185 million in combined investment, including RM92 million in government R&D funding under the Malaysia Science Endowment (MSE) Trust Fund and RM93 million contributed by industry partners, MAPC reflects a strategic whole-of-nation approach to accelerate Malaysia\u2019s advanced packaging capabilities.<\/p>\n

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The initiative aims to enable Malaysia to develop domestic capabilities in advanced semiconductor packaging within the next two years, supporting the country\u2019s ambition to move beyond traditional Outsourced Semiconductor Assembly and Test (OSAT) activities into higher-value semiconductor manufacturing.<\/p>\n

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Malaysia Advanced Packaging Consortium (MAPC): Accelerating Advanced Packaging Innovation<\/h2>\n

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The Malaysia Advanced Packaging Consortium (MAPC) is a collaborative national initiative established to accelerate research, development, and commercialisation in advanced semiconductor packaging technologies. The consortium brings together semiconductor manufacturers, technology providers, engineering specialists, and ecosystem partners to strengthen Malaysia\u2019s capabilities in next-generation semiconductor manufacturing.<\/p>\n

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NSW Automation contributes high-precision dispensing expertise to support the development of Malaysia\u2019s advanced semiconductor packaging ecosystem<\/p>\n

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As global demand continues to increase for artificial intelligence (AI), high-performance computing (HPC), automotive electronics, photonics, and heterogeneous integration technologies, advanced packaging has become one of the fastest-growing segments within the semiconductor industry. These technologies play an increasingly important role in improving chip performance, energy efficiency, miniaturisation, and system integration.<\/p>\n

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Malaysia is currently recognised as the world\u2019s sixth-largest semiconductor exporter, with decades of strength in semiconductor manufacturing. However, much of the country\u2019s expertise has historically focused on traditional OSAT operations. Through MAPC, Malaysia aims to strengthen local intellectual property (IP), accelerate advanced packaging innovation, and expand participation in higher-value semiconductor segments.<\/p>\n

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The initiative is also aligned with Malaysia\u2019s National Semiconductor Strategy (NSS), which prioritises advanced packaging as a key area to strengthen national competitiveness within the global semiconductor ecosystem.<\/p>\n

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NSW Automation Among the Founding Members of MAPC<\/h2>\n

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NSW Automation is honoured to be one of the five founding members of MAPC alongside:<\/p>\n

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