{"id":19840,"date":"2024-10-23T20:04:16","date_gmt":"2024-10-23T12:04:16","guid":{"rendered":"https:\/\/nswautomation.com\/NSW\/?post_type=wpdmpro&#038;p=19840"},"modified":"2025-03-19T10:58:53","modified_gmt":"2025-03-19T02:58:53","slug":"micro-bumping-via-paste-dispensing-technology-for-advanced-packaging-whitepaper","status":"publish","type":"wpdmpro","link":"https:\/\/nswautomation.com\/NSW\/downloads\/micro-bumping-via-paste-dispensing-technology-for-advanced-packaging-whitepaper\/","title":{"rendered":"Micro Bumping via Paste Dispensing Technology for Advanced Packaging (Whitepaper)"},"content":{"rendered":"<div class=\"wpb-content-wrapper\"><p>[vc_row][vc_column][vc_raw_html css=&#8221;&#8221;]JTNDbWV0YSUyMG5hbWUlM0QlMjJyb2JvdHMlMjIlMjBjb250ZW50JTNEJTIyaW5kZXglMkMlMjBmb2xsb3clMjIlM0U=[\/vc_raw_html]<div class=\"ult-spacer spacer-69ea6292e831e\" data-id=\"69ea6292e831e\" data-height=\"50\" data-height-mobile=\"50\" data-height-tab=\"50\" data-height-tab-portrait=\"\" data-height-mobile-landscape=\"\" style=\"clear:both;display:block;\"><\/div>[\/vc_column][\/vc_row][vc_row][vc_column][vc_column_text css=&#8221;&#8221;]<span style=\"font-size: 9pt;\"><em><strong>Author(s)<\/strong><\/em>: Senthil Kumar Balasubramanian, Yam Lip Huei, Edrina Risson Olakkankal, Zhang Rui Fen from Heraeus Materials Singapore Pte. Ltd &amp; Tai Kian Chong, Muizzuddin Azfar from NSW Automation<\/span>[\/vc_column_text][vc_column_text css=&#8221;&#8221;]<span style=\"font-size: 10pt;\"><span id=\"input-sentence~0\">As semiconductor designs become smaller and more complex, traditional stencil printing methods are no longer effective for applying solder paste. This white paper &#8220;Micro bumping via Paste Dispensing Technology for Advanced Packaging&#8221; addresses these challenges, highlighting the need for <a href=\"https:\/\/nswautomation.com\/NSW\/solder-paste-dispensing\/\">precise solder paste<\/a> formulation and specialized equipment like squeezing pumps and time-pressure systems.<\/span><span id=\"input-sentence~1\"><\/span><\/span><\/p>\n<p><span style=\"font-size: 10pt;\">In this collaboration between Heraeus and NSW Automation, the paper presents practical solutions for achieving ultra-fine, defect-free solder dots, offering valuable insights for improving modern packaging processes.<span id=\"input-sentence~2\"><\/span><\/span>[\/vc_column_text][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Learn how micro-bumping with advanced paste dispensing technology enhances precision in semiconductor advanced packaging.<\/p>\n","protected":false},"author":9,"featured_media":19845,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"wpdmcategory":[91],"wpdmtag":[],"class_list":["post-19840","wpdmpro","type-wpdmpro","status-publish","has-post-thumbnail","hentry","wpdmcategory-publications-and-white-paper"],"_links":{"self":[{"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/wpdmpro\/19840","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/wpdmpro"}],"about":[{"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/types\/wpdmpro"}],"author":[{"embeddable":true,"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/comments?post=19840"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/media\/19845"}],"wp:attachment":[{"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/media?parent=19840"}],"wp:term":[{"taxonomy":"wpdmcategory","embeddable":true,"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/wpdmcategory?post=19840"},{"taxonomy":"wpdmtag","embeddable":true,"href":"https:\/\/nswautomation.com\/NSW\/wp-json\/wp\/v2\/wpdmtag?post=19840"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}