Chinese Website
- Version: Aug 24
- Total Download: 2
- File Size: 664.69 KB
- File Count: 1
- Created on: October 24, 2024
- File Type: pdf
Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-thin Micro Dam Structures (Whitepaper)
Author(s): Patrick Schirmer, Severin Ringelstetter from DELO Industrial Adhesives & Kian Chong Tai, Muizzuddin Azfar from NSW Automation.
This paper provides insights into cutting-edge adhesive formulations and high-precision dispensing technologies, delivering robust solutions for achieving ultra-thin microstructures critical to modern semiconductor designs.
Your Download File
File name:| File | |
|---|---|
| NSW_Delo_Whitepaper_Pushing_the_Limits_of_Miniaturization_Application_of_Ultra-thin_Micro_Dam_Structures_Aug_24.pdf |