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N4 Full-Range Solder Paste Micro-dispenser
Unveiled an all new format of solder paste micro-dispensing solutions as ‘All-in-one system’ at one go. Complete solution designed to solve micro-soldering adaptability where stencil solder, jet or printing underperform.
Best Versatility & Product Time-to-Market.
The N4 pioneered a full range of innovative micro-soldering versatility where both stencil and jet printing are underachieve. It contributes the best versatility to overcome many challenges in conventional soldering processes, such as printable size limitation, printing constraints in complex board design, low production yield, time-consuming in stencil optimization, handling load of various product conversions…etc.
The N4 has implanted with the latest patented SynchroPULSE-MICRO dispensing & Dynamic-shockwave jetting technologies which enable full-range solder paste deposition experience that completed in a single system footprint.
Patented Micro-dispensing & Jet Printing Tech in the same system.
SMART Rework Function & Support Complex Board Design
- Intelligent post-rework function.
- Support board design with flat, protruded, cavity, stacked, random and high-density assembly.
- Large board handling size up to X400mm – Y475mm.
All-in-One Platform in Performing Solder Paste Dispensing / Jet Printing
- Patented micro-dispensing & jet printing technologies in the same system footprint.
- Breakthrough 80 µm dispensed size / 0.3 nanolitre dispensed volume by type-6 solder paste.
- Fast dispense speed, could achieve >20k dph.
Technical Specifications
*All specification results shown may vary depending on test method. All products, specifications and data are subject to change without notice to improve reliability, function or design or otherwise.
