NSW Automation Becomes a Founding Member of Malaysia Advanced Packaging Consortium (MAPC) to Advance Semiconductor Innovation

NSW Automation is proud to be a founding member of the Malaysia Advanced Packaging Consortium (MAPC), a national initiative established to accelerate advanced semiconductor packaging capabilities and strengthen Malaysia’s position within the global semiconductor value chain.

Representatives from the MAPC founding members during the Memorandum of Understanding (MOU) signing ceremony at SEMICON Southeast Asia 2026

Officially launched through a Memorandum of Understanding (MOU) signing during SEMICON Southeast Asia 2026, MAPC represents a strategic collaboration between industry leaders and the government aimed at strengthening local innovation, developing engineering talent, and advancing Malaysia’s next-generation semiconductor manufacturing capabilities.

Backed by RM185 million in combined investment, including RM92 million in government R&D funding under the Malaysia Science Endowment (MSE) Trust Fund and RM93 million contributed by industry partners, MAPC reflects a strategic whole-of-nation approach to accelerate Malaysia’s advanced packaging capabilities.

The initiative aims to enable Malaysia to develop domestic capabilities in advanced semiconductor packaging within the next two years, supporting the country’s ambition to move beyond traditional Outsourced Semiconductor Assembly and Test (OSAT) activities into higher-value semiconductor manufacturing.

The Malaysia Advanced Packaging Consortium (MAPC) is a collaborative national initiative established to accelerate research, development, and commercialisation in advanced semiconductor packaging technologies. The consortium brings together semiconductor manufacturers, technology providers, engineering specialists, and ecosystem partners to strengthen Malaysia’s capabilities in next-generation semiconductor manufacturing.

NSW Automation contributes high-precision dispensing expertise to support the development of Malaysia’s advanced semiconductor packaging ecosystem

As global demand continues to increase for artificial intelligence (AI), high-performance computing (HPC), automotive electronics, photonics, and heterogeneous integration technologies, advanced packaging has become one of the fastest-growing segments within the semiconductor industry. These technologies play an increasingly important role in improving chip performance, energy efficiency, miniaturisation, and system integration.

Malaysia is currently recognised as the world’s sixth-largest semiconductor exporter, with decades of strength in semiconductor manufacturing. However, much of the country’s expertise has historically focused on traditional OSAT operations. Through MAPC, Malaysia aims to strengthen local intellectual property (IP), accelerate advanced packaging innovation, and expand participation in higher-value semiconductor segments.

The initiative is also aligned with Malaysia’s National Semiconductor Strategy (NSS), which prioritises advanced packaging as a key area to strengthen national competitiveness within the global semiconductor ecosystem.

NSW Automation is honoured to be one of the five founding members of MAPC alongside:

• FusionAP Sdn. Bhd.
• Inari Technology Sdn. Bhd.
• NSW Automation Sdn. Bhd.
• Pentamaster Corporation Bhd.
• SkyeChip Berhad

Collectively, consortium members contribute expertise across semiconductor manufacturing, advanced packaging, IC design, automation, precision engineering, and process development to strengthen Malaysia’s semiconductor ecosystem and support long-term industry growth.

As part of the consortium, NSW Automation contributes its expertise in high-precision fluid dispensing and automation technologies to support advanced semiconductor manufacturing processes and next-generation packaging applications.

MAPC was established with several strategic objectives aimed at strengthening Malaysia’s semiconductor competitiveness, including:

• Developing domestic capabilities in advanced semiconductor packaging within the next two years
• Accelerating research, development, and commercialisation of advanced packaging technologies
• Strengthening collaboration between industry, academia, and government to drive innovation
• Developing local semiconductor talent, engineering capabilities, and intellectual property (IP)
• Positioning Malaysia as a globally competitive hub for advanced semiconductor packaging and next-generation manufacturing

Through collaboration, the consortium aims to build a stronger and more resilient semiconductor ecosystem capable of supporting future technological advancements and long-term industry growth.

The significance of the MAPC initiative was further demonstrated through a ministerial visitation involving representatives from key government ministries, agencies, and industry stakeholders.

NSW Automation sharing its technology capabilities with government officials during the MAPC ministerial visit

NSW Automation was privileged to welcome:

• Yang Berhormat Chang Lih Kang, Minister of Science, Technology and Innovation (MOSTI)
• Yang Berhormat Akmal Nasrullah Mohd Nasir, Minister of Economy
• Yang Berhormat Sim Tze Tzin, Deputy Minister of Investment, Trade and Industry (MITI)
• Yang Mulia Tengku Mohd Azzman Shariffadeen, President of Academy of Sciences Malaysia (ASM) and STI Advisor to the Prime Minister and the Nation
• Yang Bahagia Nagulendran Kangayatkarasu, Secretary General of MOSTI

The delegation was joined by representatives from MOSTI, Cradle Fund, MIMOS, MITI, the Ministry of Economy, Academy of Sciences Malaysia (ASM), and Collaborative Research in Engineering, Science and Technology (CREST).

The ministerial visit underscored the Malaysian government’s commitment to strengthening semiconductor innovation through public-private collaboration and expanding national capabilities in advanced semiconductor packaging technologies.

If successful, MAPC is expected to strengthen local industry capabilities, create high-value jobs, attract investment, retain domestic intellectual property, and generate long-term economic returns for Malaysia.

As a founding member of MAPC, NSW Automation plays a pivotal role in supporting the consortium’s vision by contributing advanced dispensing and automation expertise for next-generation semiconductor manufacturing and advanced packaging technologies.

Through collaboration with industry, academia, and government, NSW Automation is committed to build Malaysia’s domestic capabilities in advanced packaging and strengthening the nation’s long-term semiconductor competitiveness.