Ultra-fine Solder Paste Dispensing for Heterogeneous Integration (Whitepaper)

Author(s): KC Tai from NSW Automation & Kenneth Thum, Sze Pei Lim from Indium Corporation

Applying solder paste precisely is now more important than ever. As devices shrink and become more complex, methods such as stencil solder have become ineffective. This white paper "Ultra-fine Solder Paste Dispensing for Heterogeneous Integration" discusses effective methods for applying ultra-fine solder paste to modern electronic components.

Specialists from Indium Corporation and NSW Automation, share practical research on how it’s done. It’s important to choose the right equipment, like squeezing pumps and volumetric pumps, and to use the right kind of solder paste. Getting this combination right helps avoid common issues like clogs and uneven paste flow.  It contains experimental data and detailed tests. If you work in chips, electronics and semiconductors, you need to improve how you apply solder paste. This paper gives you easy-to-follow tips and advice to help you improve your results.