Micro Bumping via Paste Dispensing Technology for Advanced Packaging (Whitepaper)

Author(s): Senthil Kumar Balasubramanian, Yam Lip Huei, Edrina Risson Olakkankal, Zhang Rui Fen from Heraeus Materials Singapore Pte. Ltd & Tai Kian Chong, Muizzuddin Azfar from NSW Automation

As semiconductor designs become smaller and more complex, traditional stencil printing methods are no longer effective for applying solder paste. This white paper "Micro bumping via Paste Dispensing Technology for Advanced Packaging" addresses these challenges, highlighting the need for precise solder paste formulation and specialized equipment like squeezing pumps and time-pressure systems.

In this collaboration between Heraeus and NSW Automation, the paper presents practical solutions for achieving ultra-fine, defect-free solder dots, offering valuable insights for improving modern packaging processes.