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- Version: Aug 24
- Total Download: 6
- File Size: 664.69 KB
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- Created on: October 24, 2024
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Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-thin Micro Dam Structures (Whitepaper)
Author(s): Patrick Schirmer, Severin Ringelstetter from DELO Industrial Adhesives & Kian Chong Tai, Muizzuddin Azfar from NSW Automation.
This paper provides insights into cutting-edge adhesive formulations and high-precision dispensing technologies, delivering robust solutions for achieving ultra-thin microstructures critical to modern semiconductor designs.
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