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Flashback to an Important Moment: Whitepapers Publishing at IEMT Penang 2024
By NSW Marketing Team. Written on November 28, 2024.
Our Important Moment at IEMT Penang 2024
We are delighted to have participated in IEMT 2024 organized by IEEE, where we had the opportunity to present our newly released whitepapers. It was a proud moment for us to collaborate with Delo Industrial Adhesives and Heraeus Group on their respective projects. As highlighted in our whitepapers, we showcased how our technologies are significantly enhancing the advanced packaging process.
Whitepaper with Delo
Together with our partner Delo Industrial Adhesives, we had the honor of presenting a whitepaper titled “Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-thin Micro Dam Structures“. Our focus was on the application of ultra-thin micro dam structures, which have allowed us to develop a solution that opens new possibilities in heterogeneous integration and optical packaging. This collaboration has been instrumental in pushing the boundaries of what is possible in the industry.
Whitepaper with Heraeus
We were also thrilled to be part of a whitepaper presented by Mr. Senthil from Heraeus Group, who traveled from Singapore to meet us at IEMT 2024. Titled “Micro Bumping via Paste Dispensing Technology for Advanced Packaging” the paper demonstrates how Heraeus’s Welco™ technology, combined with NSW Automation’s squeezing pump method and innovative nozzle design, enhances dispensing capabilities. This collaboration allows for the achievement of ultra-fine dot sizes without the risk of nozzle clogging, further advancing the field of microelectronic packaging.
Celebrating the Power of Collaboration
We would like to extend our heartfelt thanks to our partners, Delo and Heraeus, for their exceptional cooperation throughout this research. Their support has been instrumental in facilitating the flow of information and driving these advancements forward. Additionally, we are grateful to our dedicated NSW team members, whose hard work and commitment have been vital in bringing these projects to fruition.
At IEMT 2024, we celebrated the power of collaboration, which continues to fuel our passion for innovation and excellence in the microelectronic packaging industry. We look forward to future partnerships and groundbreaking advancements that will shape the future of technology.
About IEMT
The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established international conference of long standing organized by the Electronics Packaging Society (EPS) Society of IEEE.