MEMS Micro-dispensing Solution for Precision Manufacturing

Author: Saw Ying Xuan,  Last update on September 17, 2025, Prepared by the NSW Automation Marketing Team

Micro-electromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) are the cornerstone of today’s miniaturized technology, enabling advancements in smartphones, medical devices, automotive sensors, and beyond. As MEMS devices continue to shrink while increasing in complexity, the demand for high-precision material deposition techniques becomes critical. Micro dispensing, a non-contact and highly accurate method of applying minute volumes of fluid, plays a pivotal role in manufacturing and packaging MEMS devices.

Why MEMS Devices Rely on Micro-dispensing?

MEMS devices are everywhere:
Accelerometers in smartphones
Pressure sensors in medical tools
Micro-Display Mirror in projectors
Gyroscopes in drones

NSW Automation provide MEMS micro dispensing solution

These tiny components need spot-on precision to function properly. A slight overflow of adhesive or a misaligned coating can ruin an entire chip.

That’s why NSW Autotmation Micro-dispensing is essential—and not just helpful.

Real MEMS Applications, Real Impact with Micro-dispensing Solution

Let’s look at where NSW Autotmation Micro-dispensing makes a difference in MEMS:

NSW Automation dispense on MEMS Micro Dispensing Solutions

1. High-Density Lid Attach Soldering

MEMS ASIC Micro Dispensing Solution

Our micro-dispensing technologies enables solder lines as thin as 80µm, ensuring secure bonding, hermetic sealing, and enhanced MEMS reliability with minimal rework.

2. Underfill Dispensing

NSW Automation Non-contact Jetting Underfill

Delivers void-free, uniform underfill for improved thermal management and mechanical stability in MEMS devices.

3. ASIC Encapsulation & Glob Top

NSW Automation - Encapsulation & Glob Top

Dynamic jetting and auto-calibration ensure complete, precise coverage, with VVI inspection for real-time quality control.

4. Adhesive Dispensing

UV Glue dispensing 80um

Ultra-fine volume control applies epoxy accurately, reducing misalignment and defects in microelectronics assembly.

5. Additive Micro-DAM Barrier

Micro-DAM Barrier MEMS Dispensing Solutions

Creates barriers as narrow as 100µm with 10:1 height-to-width ratio, preventing overflow and improving reliability in MEMS packaging.

6. Selective Conformal Coating

MEMS Coating

Protects MEMS against moisture, dust, and stress, withstanding reflow temperatures up to 260°C for long-term durability.

7. Adaptive Interface Gel Cavity Filling

MEMS Interface Gel Micro-Dispensing Solution

Dispenses gel into cavities to absorb vibration and protect sensitive MEMS components, enhancing performance and stability.

Key Benefits of MEMS Micro-dispensing

Unlike traditional methods, advanced micro dispensing systems can deliver droplets as small as a few picolitres. That means:

High precision – exact dot and line placement, even at micron scale
Non-contact application – protects fragile MEMS structures
Material efficiency – reduces waste, improves yield
Repeatability – every drop lands exactly where it should, every time
No substrate contact – avoids damage to sensitive components

In short, MEMS manufacturing depends on consistency, cleanliness, and control—and micro dispensing delivers all three.

Conclusion: Precision That Powers the Future

MEMS technology may be microscopic, but it’s making a massive impact on our daily lives. Behind every successful MEMS device is a precise, repeatable, and clean dispensing process.

Whether you’re developing next-generation sensors, scaling up MEMS production, or exploring new materials, micro dispensing solutions are the key to unlocking performance, reliability, and innovation.

Get Started with Our Micro-dispensing Technology!

Enhance your MEMS packaging efficiency and reliability with our Micro-dispensing technology. Contact us today to learn how our solutions can optimize your manufacturing process! 

1. IDENTIFY YOUR PRODUCT/PROCESS

Workpiece
• Leadframe
• Wafer
• Substrate

2. CONFIGURE YOUR DISPENSING SOLUTIONS

Equipments + Pump & Valve

3. POST-DISPENSING SOLUTIONS

Customization
• Modular VVI/ AOI Check
• Material Height Scan
• Custom Vision Features
• Robotic Handler
• Equipment Integration

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