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SD1-X Automated Intelligent Micro-dispenser
SD1 Series: The Revolution Is Now
Meet the SD1-X, a whole new level towards smart productivity. Not only does it solve your stencil dilemma, but it also transcends the barriers of conventional die or lid-attached applications too. It significantly exceeds the limitation of stencil dot printing of 180um and solder bumping limitation of 150um – giving you precision like none other. The SD1-X dispenses at a minimum of 80um, with gaps as small as 20um, and downsizes equipment footprint up to 48%!
The SD1-X is a one-stop solution. Designed with six independent axes on a dual gantry, this automated intelligent dispenser is portable and fully upgraded with our next-gen SynchroPULSE-Micro™ dispensing technology. Its dual gantry features enable concurrent dual independent processes for higher throughput while its smart algorithm runs pre and post-inspections instantaneously to ensure no errors are made. The SD1-X is goliath stable and maintains superior dispensing accuracy at low-cost ownership targeted for 3D-SiP, MEMS, and miniature packages.
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Key Highlights Features:
Dual Gantry: Dual Process
More hands complete more work, but it requires additional resources. With our intelligent dual micro-dispensing head, you can increase your productivity and process scalability. The SD1-X can handle different tasks with its dual, fully independent dual gantry motion platform. It adopts two micro-dispensing heads and with six independent axis-controlled gantry configurations on a separate XYZ axis. You can easily double production throughput compared to typical 3-axis platforms. No quality compromised at all!
Industry 4.0 Ready - Smarter Algorithm
SD1-X is perfect for solving today’s automated intelligent dispensing needs. Our revolutionary AI algorithm enables self-verification and automatic compensation to augment dispensing processes. Our intelligent gantries can independently inspect, analyze, calibrate, dispense, and even revise instantaneously, saving you precious time and space. Its self-validation checks minimize human inaccuracies and significantly optimizes production yields. Variable substrates, board cavities, and different sized components can be challenging. Through automatic compensation, exact height and weight can be cerebrally measured to meet dispensing precision accurately of up to 95% yield.
Partnered with Indium Corporation
For ease of use, We recommend SAC305 Indium12.8HF solder paste from Indium Corporation for ultra-fine solder paste dispensing. Proven with verified results, it is suitable for accurate dispensing and hassle-free management. With its no-clean, halogen-free material, Indium’s solutions are exclusively formulated to pair with our wide range of contact micro dispensing at a resolution as small as 80µm.
To learn more about Indium solder paste visit:
https://www.indium.com/corporate/communications/news/indium-corporations=proven-microdispensing-paste-recommended-by-nsw-automation/
*For more info on the white paper go to:
https://www.nswautomation.com/NSW/downloads/ultra-fine-solder-paste-dispensing
Micro-dispensing Just Got Better with 100% closed loop design
The headaches to dispense in tiny areas are real – especially with microscopic electronics. The micro-dispensing SD1-X has precision like no other. It can accurately mark miniature dispensing ranges (as tiny as 80micron) with solder paste or any other conductive or non-conductive materials. You can now dispense in microscopic spaces with T6 solder paste to reach complex areas.
High Reliability with Superior Design
Designed for precision, the SD1-X is extremely reliable in dispensing and control and goliath steady. It is designed to hold fixtures to support high and constant dispensing process intelligently. It is built onto a solid granite structure that is run on our fine resolution linear motor drive system. You can count on its extremely reliable motion synchronizations, accuracies, and swiftness.
Passionately Crafted for Miniature Applications
The SD1-X is tailor-made for micro-dispensing processes dedicated to substrate-based semiconductor devices, especially in conductive material dispensing before dying or lid attaching processes. It is best used for miniaturization applications like MEMS, Sip, 3D-SiP, COB, and particular small size PCB in SMT Hybrid electronics industries.